10oz Heavy Copper TU-865 PCB – Double-Sided 3.0mm Thick for Harsh Environments

1. Introduction of TU-865

The TU-865 Tg200 material is composed of epoxy resin and E-glass fabric. It is a halogen-free material designed for harsh environments, high-reliability applications, and superior electrical performance. TU-865 meets the UL94V-0 flammability classification by incorporating phosphorus and nitrogen compounds. This material is compatible with the AOI process and exhibits UV-blocking characteristics. TU-865P is a prepreg designed for use with TU-865 laminate to create multilayer printed wire boards. TU-865 is also available for single and double-sided applications. This series of green materials eliminates halogenated resins, thereby addressing environmental concerns while maintaining excellent performance. These products are suitable for boards that must endure severe thermal cycling or excessive assembly work. TU-865 laminates also demonstrate superior chemical resistance, dimensional stability, and moisture resistivity for lead-free soldering assembly and CAF resistance.

2. Key features (TU-865)

High Tg (DSC) of 200°C, Tg (TMA) 185°C
Dielectric constant of 4.4 @ 10GHz
Dissipation factor of 0.014 @ 10GHz
Low coefficient of thermal expansion
Excellent moisture resistance of 0.13%
Lead-free processing compatible
Anti-CAF capability
Exceptional through-hole and soldering reliability
Environmentally friendly materials

3.Basic PCB Specifications

4.PCB Stack-up: 2-layer Rigid PCB (Component side at top)

5. PCB Statistics:

Components: 38
Total Pads: 98
Thru Hole Pads: 35
Top SMT Pads: 26
Bottom SMT Pads: 12
Vias: 52
Nets: 2

6.Accepted Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping

7.Typical applications

Automotive
Harsh environments
Servers
Telecom
Base stations